Analytical and Numerical Model Confrontation for Transfer Impedance Extraction in Three-Dimensional Radio Frequency Circuits
Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits
Passive Equalizer Design for Through Silicon Vias with Perfect Compensation
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Imágenes desgarradoras del sofá cubierto de heces donde el recluso, de 36 años, murió después de 'sentarse en él durante 12 años en un caso de negligencia' - Inicio
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3D Integration | SpringerLink
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RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking - ScienceDirect
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